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Microfabricated Wire Arrays for Z-Pinch.

DE2009945909

Publication Date	2008
Personal Author	Spahn, O. B.; Rowen, A. M.; Cich, M. J.; Peake, G. M.; Arrington, C. L.
Page Count	38
Abstract	Microfabrication methods have been applied to the fabrication of wire arrays suitable for use in Z. Self-curling GaAs/AlGaAs supports were fabricated as an initial route to make small wire arrays (4mm diameter). A strain relief structure that could be integrated with the wire was designed to allow displacements of the anode/cathode connections in Z. Electroplated gold wire arrays with integrated anode/cathode bus connections were found to be sufficiently robust to allow direct handling. Platinum and copper plating processes were also investigated. A process to fabricate wire arrays on any substrate with wire thickness up to 35 microns was developed. Methods to handle and mount these arrays were developed. Fabrication of wire arrays of 20mm diameter was demonstrated, and the path to 40mm array fabrication is clear. With some final investment to show array mounting into Z hardware, the entire process to produce a microfabricated wire array will have been demonstrated.
Keywords	Wire Plating Fabrication Electroplating Copper plating Gallium arsenides Indium compounds Anodes Cathodes Strains(Mechanics)
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Supplemental Notes	Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200911
Contract Number	DE-AC04-94AL85000

Microfabricated Wire Arrays for Z-Pinch.

Microfabricated Wire Arrays for Z-Pinch.
DE2009945909

Publication Date	2008
Personal Author	Spahn, O. B.; Rowen, A. M.; Cich, M. J.; Peake, G. M.; Arrington, C. L.
Page Count	38
Abstract	Microfabrication methods have been applied to the fabrication of wire arrays suitable for use in Z. Self-curling GaAs/AlGaAs supports were fabricated as an initial route to make small wire arrays (4mm diameter). A strain relief structure that could be integrated with the wire was designed to allow displacements of the anode/cathode connections in Z. Electroplated gold wire arrays with integrated anode/cathode bus connections were found to be sufficiently robust to allow direct handling. Platinum and copper plating processes were also investigated. A process to fabricate wire arrays on any substrate with wire thickness up to 35 microns was developed. Methods to handle and mount these arrays were developed. Fabrication of wire arrays of 20mm diameter was demonstrated, and the path to 40mm array fabrication is clear. With some final investment to show array mounting into Z hardware, the entire process to produce a microfabricated wire array will have been demonstrated.
Keywords	Wire Plating Fabrication Electroplating Copper plating Gallium arsenides Indium compounds Anodes Cathodes Strains(Mechanics)
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Supplemental Notes	Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200911
Contract Number	DE-AC04-94AL85000