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Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint.


DE2008929625

Publication Date 2008
Personal Author Rupnowski, P.; Sopori, B.
Page Count 7
Abstract This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.
Keywords
  • Silicon
  • Wafers
  • Photovoltaic cells
  • Defects
  • Distribution
  • Simulation
  • Residual microcracks
  • Wafer breakage
Source Agency
  • Technical Information Center Oak Ridge Tennessee
Corporate Authors National Renewable Energy Lab., Golden, CO.; Department of Energy, Washington, DC.
Supplemental Notes Sponsored by Department of Energy, Washington, DC.
Document Type Technical Report
NTIS Issue Number 200825
Contract Number
  • DE-AC36-99-GO10337
Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint.
Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint.
DE2008929625

  • Silicon
  • Wafers
  • Photovoltaic cells
  • Defects
  • Distribution
  • Simulation
  • Residual microcracks
  • Wafer breakage
  • Technical Information Center Oak Ridge Tennessee
  • DE-AC36-99-GO10337
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