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Investigations Into High Temperature Components and Packaging.

DE2008921778

Publication Date	2007
Personal Author	Marlino, L. D.; Chinthavali, M. S.; McCluskey, F. P.; Seiber, L. E.; Scudiere, M. B.
Page Count	109
Abstract	The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105oC water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability.
Keywords	Oak Ridge National Laboratory Power electronics Components High temperature Packaging Development Testing Oak Ridge National Laboratory (ORNL)
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Oak Ridge National Lab., TN.; Department of Energy, Washington, DC.; Department of Energy, Washington, DC. Office of Energy Efficiency and
Supplemental Notes	Prepared in cooperation with Department of Energy, Washington, DC. Office of Energy Efficiency and Renewable Energy. Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200813
Contract Number	DE-AC05-00OR22725

Investigations Into High Temperature Components and Packaging.

Investigations Into High Temperature Components and Packaging.
DE2008921778

Publication Date	2007
Personal Author	Marlino, L. D.; Chinthavali, M. S.; McCluskey, F. P.; Seiber, L. E.; Scudiere, M. B.
Page Count	109
Abstract	The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105oC water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability.
Keywords	Oak Ridge National Laboratory Power electronics Components High temperature Packaging Development Testing Oak Ridge National Laboratory (ORNL)
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Oak Ridge National Lab., TN.; Department of Energy, Washington, DC.; Department of Energy, Washington, DC. Office of Energy Efficiency and
Supplemental Notes	Prepared in cooperation with Department of Energy, Washington, DC. Office of Energy Efficiency and Renewable Energy. Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200813
Contract Number	DE-AC05-00OR22725