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Advanced Modeling and Simulation to Design and Manufacture High Performance and Reliable Advanced Microelectronics and Microsystems.

DE2007913216

Publication Date	2007
Personal Author	Ewsuk, K. G.; Hinklin, T.; Neilsen, M.; Tandon, R.; Arguello, J. G.
Page Count	97
Abstract	An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The teams efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in real systems, including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.
Keywords	Microsystems Integrated circuits Thermomechanical properties Simulation Modeling Materials research Infrastructures Compaction Sintering Models Stress Performance evaluations Reliability
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Supplemental Notes	Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200802

Advanced Modeling and Simulation to Design and Manufacture High Performance and Reliable Advanced Microelectronics and Microsystems.

Advanced Modeling and Simulation to Design and Manufacture High Performance and Reliable Advanced Microelectronics and Microsystems.
DE2007913216

Publication Date	2007
Personal Author	Ewsuk, K. G.; Hinklin, T.; Neilsen, M.; Tandon, R.; Arguello, J. G.
Page Count	97
Abstract	An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The teams efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in real systems, including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.
Keywords	Microsystems Integrated circuits Thermomechanical properties Simulation Modeling Materials research Infrastructures Compaction Sintering Models Stress Performance evaluations Reliability
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Supplemental Notes	Sponsored by Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200802