Publication Date |
2004 |
Page Count |
14 |
Abstract |
Extending upon development efforts last quarter to produce ''free-standing'', copper and palladium alloy films, the goal this quarter has been to produce pinhole-free, Pd-Cu alloy films up to 5 x 5 inches in area (1-3 microns thick) using both magnetron sputtering and e-beam evaporation on PVA (Solublon) and polystyrene backing materials. A set of experiments were conducted to assess processing methods/solutions chemistry for removing the polymer backing material from the Pd-Cu film. For all of the alloy films produced to this point, we were unable to produce pinhole-free films on plastic although we were able to produce free-standing Pd-Cu films at less than 0.5 microns thick with minimal intrinsic stress. Subsequently, to evaluate gas permeation and leakage across the films, two films were sandwiched together on top of a porous Monel support disc (25 mm in diameter) and then tested in a leak test apparatus. Using two Cu films (10 micron thickness total) in the sandwich configuration, leak rates were about 20% of the background leak rate. |
Keywords |
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Source Agency |
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Corporate Authors |
Southwest Research Inst., San Antonio, TX.; Colorado School of Mines, Golden.; Department of Energy, Washington, DC.; National Energy Technology Lab., Pittsburgh, PA. |
Supplemental Notes |
Prepared in cooperation with Colorado School of Mines, Golden. and National Energy Technology Lab., Pittsburgh, PA. Sponsored by Department of Energy, Washington, DC. |
Document Type |
Technical Report |
NTIS Issue Number |
200519 |