| Publication Date |
2003 |
| Personal Author |
Myers, R. L.; Ritchey, M. B.; Stokes, R. N.; Casias, A. L.; Adams, D. P.; Oliver, A. D.; Emerson, J. A. |
| Page Count |
52 |
| Abstract |
Many microfabrication techniques are being developed for applications in microelectronics, microsensors, and micro-optics. Since the advent of microcomponents, designers have been forced to modify their designs to include limitations of current technology, such as the inability to make three-dimensional structures and the need for piece-part assembly. Many groups have successfully transferred a wide variety of patterns to both two-dimensional and three-dimensional substrates using microcontact printing. Microcontact printing is a technique in which a self-assembled monolayer (SAM) is patterned onto a substrate by transfer printing. The patterned layer can act as an etch resist or a foundation upon which to build new types of microstructures. We created a gold pattern with features as small as 1.2 micrometers using microcontact printing and subsequent processing. This approach looks promising for constructing single-level structures such as microelectrode arrays and sensors. It can be a viable technique for creating three-dimensional structures such as microcoils and microsprings if the right equipment is available to achieve proper alignment, and if a means is available to connect the final parts to other components in subsequent assembly operations. Microcontact printing provides a wide variety of new opportunities in the fabrication of microcomponents, and increases the options of designers. |
| Keywords |
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| Source Agency |
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| Corporate Authors |
Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC. |
| Supplemental Notes |
Sponsored by Department of Energy, Washington, DC. |
| Document Type |
Technical Report |
| NTIS Issue Number |
200412 |
