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Final Report and Documentation for the Optical Backplane/Interconnect for High Speed Communication LDRD.

DE2001780305

Publication Date	2001
Personal Author	Robertson, P. J.; Chen, H. Y.; Brandt, J. M.; Sullivan, C. T.; Pierson, L. G.
Page Count	72
Abstract	Current copper backplane technology has reached the technical limits of clock speed and width for systems requiring multiple boards. Currently, bus technology such as VME and PCI (types of buses) will face severe limitations are the bus speed approaches 100 MHz. At this speed, the physical length limit of an unterminated bus is barely three inches. Terminating the bus enables much higher clock rates but at drastically higher power cost. Sandia has developed high bandwidth parallel optical interconnects that can provide over 40 Gbps throughput between circuit boards in a system. Based on Sandia's unique VCSEL (Vertical Cavity Surface Emitting Laser) technology, these devices are compatible with CMOS (Complementary Metal Oxide Semiconductor) chips and have single channel bandwidth in excess of 20 GHz. In this project, we are researching the use of this interconnect scheme as the physical layer of a greater ATM (Asynchronous Transfer Mode) based backplane. There are several advantages to this technology including small board space, lower power and non-contact communication. This technology is also easily expandable to meet future bandwidth requirements in excess of 160 Gbps sometimes referred to as UTOPIA 6. ATM over optical backplane will enable automatic switching of wide high-speed circuits between boards in a system. In the first year we developed integrated VCSELs and receivers, identified fiber ribbon based interconnect scheme and a high level architecture. In the second year, we implemented the physical layer in the form of a PCI computer peripheral card. A description of future work including super computer networking deployment and protocol processing is included.
Keywords	Computer architecture Data transmission systems Communications Documentation Equipment interfaces Design
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200125
Contract Number	AC04-94AL85000

Final Report and Documentation for the Optical Backplane/Interconnect for High Speed Communication LDRD.

Final Report and Documentation for the Optical Backplane/Interconnect for High Speed Communication LDRD.
DE2001780305

Publication Date	2001
Personal Author	Robertson, P. J.; Chen, H. Y.; Brandt, J. M.; Sullivan, C. T.; Pierson, L. G.
Page Count	72
Abstract	Current copper backplane technology has reached the technical limits of clock speed and width for systems requiring multiple boards. Currently, bus technology such as VME and PCI (types of buses) will face severe limitations are the bus speed approaches 100 MHz. At this speed, the physical length limit of an unterminated bus is barely three inches. Terminating the bus enables much higher clock rates but at drastically higher power cost. Sandia has developed high bandwidth parallel optical interconnects that can provide over 40 Gbps throughput between circuit boards in a system. Based on Sandia's unique VCSEL (Vertical Cavity Surface Emitting Laser) technology, these devices are compatible with CMOS (Complementary Metal Oxide Semiconductor) chips and have single channel bandwidth in excess of 20 GHz. In this project, we are researching the use of this interconnect scheme as the physical layer of a greater ATM (Asynchronous Transfer Mode) based backplane. There are several advantages to this technology including small board space, lower power and non-contact communication. This technology is also easily expandable to meet future bandwidth requirements in excess of 160 Gbps sometimes referred to as UTOPIA 6. ATM over optical backplane will enable automatic switching of wide high-speed circuits between boards in a system. In the first year we developed integrated VCSELs and receivers, identified fiber ribbon based interconnect scheme and a high level architecture. In the second year, we implemented the physical layer in the form of a PCI computer peripheral card. A description of future work including super computer networking deployment and protocol processing is included.
Keywords	Computer architecture Data transmission systems Communications Documentation Equipment interfaces Design
Source Agency	Technical Information Center Oak Ridge Tennessee
Corporate Authors	Sandia National Labs., Albuquerque, NM.; Department of Energy, Washington, DC.
Document Type	Technical Report
NTIS Issue Number	200125
Contract Number	AC04-94AL85000