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RAAM Integrated Circuit Source Change Analysis.


ADA227325

Publication Date 1990
Personal Author Printz, J.
Page Count 36
Abstract This report prepared to provide an analysis of the change from gold eutectic die attach integrated circuits (I.C.) to sliver-glass die attach I.C. for the M718/M741 remote antiarmor mine (RAAM). An overview of the contract history of the present RAAM electronic lens assembly (ELA) contractor, Accudyne Corporation of Janesville, WI, is presented. An outline of both the gold eutectic die attached process and the silver-glass die attach process is also given. The Government test plan for the die attach change was analyzed and the results and conclusions of the tests listed in the plan are provided. Keywords: Integrated circuits; Land mines; Antiarmor mines. (RH)
Keywords
  • Eutectics
  • Integrated circuits
  • Land mines
  • Antiarmor ammunition
  • Assembly
  • Contracts
  • Dies
  • Electronic equipment
  • Gold
  • History
  • Lenses
  • Mines(Ordnance)
  • Planning
  • Test and evaluation
  • RAAM(remote antiarmor mine)
Source Agency
  • Non Paid ADAS
NTIS Subject Category
  • 79A - Ammunition, Explosives, & Pyrotechnics
  • 49H - Semiconductor Devices
Corporate Authors Army Armament Research and Development Center, Dover, NJ. Fire Support Armament Center.
Document Type Technical Report
Title Note Final rept. 1989-1990.
NTIS Issue Number 199108
RAAM Integrated Circuit Source Change Analysis.
RAAM Integrated Circuit Source Change Analysis.
ADA227325

  • Eutectics
  • Integrated circuits
  • Land mines
  • Antiarmor ammunition
  • Assembly
  • Contracts
  • Dies
  • Electronic equipment
  • Gold
  • History
  • Lenses
  • Mines(Ordnance)
  • Planning
  • Test and evaluation
  • RAAM(remote antiarmor mine)
  • Non Paid ADAS
  • 79A - Ammunition, Explosives, & Pyrotechnics
  • 49H - Semiconductor Devices
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